星载厚膜混合集成SSPC故障分析与研究

Fault Analysis and Research on Space-Based Thick Film Hybrid Integrated SSPC

中文关键词:  SSPC  测试技术  故障分析  可靠性

英文关键词:SSPC  test technology  fault analysis  reliability

中文摘要:

      以厚膜及半导体技术为基础的厚膜混合集成固态功率控制器（SSPC）具有智能化、高度集成、高可靠等突出优点，已广泛应用到宇航电子产品中。对某SSPC产品测试故障进行了研究，采用无损测试及显微检查方法，分析了SSPC生产测试过程中出现的短路、断路、跳闸、误动作等故障现象，从电路原理及生产过程对故障原因进行了系统分析，总结了不同质量问题所导致的测试故障情况，形成了典型的故障案例。结果表明，原材料问题及生产过程误操作是导致SSPC产品测试故障的两大原因，总结形成了相应检验方法及操作规范，对提升后续产品质量具有一定意义。

英文摘要:

      The thick film hybrid integrated solid state power controller (SSPC) based on thick-film and semiconductor technology that has been widely used in aerospace electronics has outstanding advantages of intelligence,high integration and high reliability.The product test failures of a type of SSPC were studied.Nondestructive testing and microscopic inspection methods were used to analyze the short circuit,open circuit,tripping,malfunction and other symptoms that occurred during the production test of SSPC.The causes of test faults were analyzed systematically based on circuit principle and production process,the test failures caused by different quality problems were summarized,and the typical failure cases were formed.The results show that raw material problems and production misoperation are two major causes of SSPC product test failures.The corresponding inspection methods and operations specifications are summarized and formed,which are of great significance for improving the quality of follow-up products.