陶瓷基底薄膜热电偶的研究现状及发展趋势

Research Status and Development Trend of Ceramic Substrate Thin-Film Thermocouple

中文关键词:  陶瓷基底  高温薄膜热电偶  工艺参数

英文关键词:ceramic substrate  high-temperature film thermocouple  process parameters

中文摘要:

      随着航空发动机推重比的不断提升，发动机热端部件的工作温度也不断提高，对高温测量也提出了更高的要求。未来航空发动机将采用陶瓷基底复合材料制造叶片，因此以陶瓷为基底的高温薄膜热电偶成为当前的研究热点。介绍了国内外陶瓷基底高温薄膜热电偶的研究现状以及工艺参数对薄膜制备过程的影响，并指出其存在的问题，最后对高温薄膜热电偶的发展方向进行了展望。

英文摘要:

      With the continuous improvement of the thrust-to-weight ratio of aero-engines,the working temperature of the engine hot-end components is also increasing,which puts forward higher requirements for high-temperature measurement.The aero-engines will use ceramic matrix composites to manufacture blades in the future,so high-temperature thin-film thermocouple based on ceramics has become a current research hotspot.The research status of high-temperature thin-film thermocouple with ceramic substrate at home and abroad and the influence of process parameters on the thin-film preparation process are introduced,and its existing problems are pointed out.Finally,the development direction of high-temperature thin-film thermocouple is prospected.